Modifying the ARM Integrator AP SDB Switches and Jumpers
The S1 dual in-line package (DIP) switch is used to choose where the code starts execution.
The following table shows the function of DIP switch 1.
| S1-1 | S1-2 | S1-3 | S1-4 | Function |
|---|---|---|---|---|
| On | X | X | X | Boots the boot monitor after a reset. Debug communication is by means of the serial debug port. |
| Off | X | X | X | Boots the image from flash, which is either the boot loader or the OS image. |
The following table shows the function of DIP switch 2. Using this switch allows your Ethernet boot loader to exist in flash at the same time as your OS image.
| S1-1 | S1-2 | S1-3 | S1-4 | Function |
|---|---|---|---|---|
| Off | Off | X | X | Boot loader will download a new image. |
| Off | On | X | X | Boot loader will jump to an image in flash. |
See Also
How to Use the BSP for the ARM Integrator AP SDB | Setting Up the ARM Integrator AP SDB Hardware
Last updated on Wednesday, April 13, 2005
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